Author(s): Hopkins P. E.  

    |     ISSN: 3005-2092  

This work reviews a series of both historical and recent works reporting on the thermal properties of various low-dimensional carbon films and their interfaces, the research for which was funded via various programs in the United State Department of Defense.

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ABSTRACT

The high thermal conductivities exhibited by graphene and other low-dimensional carbon structures have generated tremendous potential for functional material solutions in a wide array of military applications. In this work, we present a series of studies focusing on experimental measurements of the thermal boundary resistance and thermal conductivity of low-dimensional carbon allotropes thin films in which the films are processed to introduce changes in the chemical bond at surfaces and interfaces. The atomic interactions are manipulated in such a way to increase to bond strength, which increases the thermal transport of these low-dimensional carbon-based films. We present studies on functionalized graphene, 2D Covalent Organic Frameworks (COFs), and a new allotrope of carbon recently discovered deemed “graphullerene” (a few layer superatomic cousin to graphene with remarkably increased thermal conductivity compared to fullerene thin films).

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